Lead-Free Solder Balls Sn96.5/Ag3/Cu0.5 (250.000pcs)

Price excluding taxesPrice including taxes
60,00/Pkg   –   148,75/Pkg73,20/Pkg   –   181,48/Pkg

To check stock availability select a diameter in the menu.
If the product is “available on order”, it could be ready for shipment after 60/90 days from the date of purchase.
For more detailed information, contact our sales office.

Product Code: SBLF
Categories: ,


BGA reballing balls – Sn/Ag/Cu alloy

Lead-free solder balls for BGA reballing, available in 9 different diameters.
Alloy composition: Sn96.5/Ag3/Cu0.5.
Packaging: 250.000 pieces jar.

Available sizes (Diameter): 0,25mm – 0,30mm – 0,35mm – 0,40mm – 0,45mm – 0,50mm – 0,55mm – 0,60mm – 0,76mm.

Additional information

RoHS (Yes/No)

Alloy composition


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